Moxa Technologies MC-4510-C23 Instrukcja Użytkownika Pobierz pdf (Strona 2)

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Industrial Computing >

Rugged Computers

Industrial Computing

18-2

Harsh Environments

Rugged Computers

Creating a fanless design presents many challenges for developers

of wide temperature products. Not only do the components need to

meet wide temperature requirements, but the hardware layout design

that integrates all peripheral computers must fulfill wide temperature

demands as well.

One of the major challenges faced by IPC manufacturers is to provide

a fanless computer that meets industrial standards and works well in

wide temperatures and harsh environments. Moxa’s design philosophy

Patented Heat Dissipation Design

Traditional externally-attached heat sinks can only go

so far. For even more robust heat dissipation, Moxa has

patented an innovative “L and H-type” heat sink that

makes direct contact with the major inner heat sources to

cool down a device’s internal temperature.

emphasizes compact and elegant architectures that do not use fans.

A fanless design reduces size, complexity, susceptibility to dust,

and wear and tear. Instead of taking shortcuts by using problematic

components, Moxa selects components that generate less heat but can

still maintain high system performance. The result is a more stable,

reliable, and cost effective system that dramatically reduces total cost

of ownership.

Fanless Design for Wide Operating Temperatures

Moxa’s Industrial-grade Design Conventional Design

-40 to 75°C operating temp.

-10 to 60°C or

-40 to 75°C storage temp.

40-hour uninterrupted burn-in N/A

Rigorous chamber testing:

Forced-convection and

natural-convection thermal chambers

simulate real-world conditions

Standard chamber testing:

Forced-convection thermal

chamber

BIOS

Dynamic Throttling Technology

N/A

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